Kingdom Come: Deliverance 2 devs tweet ‘Blame the French!’ after losing every Game Awards category to Clair Obscur, but it was in good fun: They partied together after

The developers behind Kingdom Come: Deliverance 2 prepared thoroughly for Thursday’s Game Awards. In a tweet posted a few hours before the ceremony, they shared a screenshot of two image folders on a Windows desktop: “memes if we win GOTY” and “memes if we don’t win GOTY.” The latter turned out to come in clutch,…

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Internet not convinced it should care about another PvP hero shooter, collective eye-roll plunges big Game Awards finale reveal into a YouTube dislikes hole

The Game Awards ended on an odd note last night. Instead of a big, exclamation-point ‘one more thing!’—the prophesied return of Gabe Newell, striding onto center stage with three fingers held high—host Geoff Keighley closed the show with a reveal of a brand new game from an unknown studio: A PvP raid shooter called Highguard….

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‘Our ambition is to keep this game alive for the longest time’: Embark’s devs want to keep working on Arc Raiders ‘as long as players engage with it and have fun’

We had an inkling that Arc Raiders was going to be good when it released, following a massively successful beta, but I don’t think anyone could’ve predicted it’d achieve this kind of success. Following on from over 700,000 concurrents in just one weekend, a streamer civil war, and recently winning best multiplayer game at The…

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MIT electronics researchers develop a new way to fabricate transistors on the backend of finished dies, to keep pushing the limit of chip densities ever higher

With smaller process nodes becoming increasingly more expensive to achieve, chip manufacturing engineers are turning to other ways to increase the number of transistors that can be packed into a single die. In some ways similar to traditional chip stacking, one research team has created a way to implement an extra layer of microscopic switches…

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MIT electronics researchers develop a new way to fabricate transistors on the backend of finished dies, to keep pushing the limit of chip densities ever higher

With smaller process nodes becoming increasingly more expensive to achieve, chip manufacturing engineers are turning to other ways to increase the number of transistors that can be packed into a single die. In some ways similar to traditional chip stacking, one research team has created a way to implement an extra layer of microscopic switches…

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